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  4. HiSilicon Kirin 9000 vs Qualcomm Snapdragon 845

HiSilicon Kirin 9000 vs Qualcomm Snapdragon 845

General

  • Device Type
    Mobile Platform Mobile Platform
  • Model
    Kirin 9000 SDM845
  • Announced
    October 2020 December 2017

CPU & GPU

Camera

  • Dual Camera
    Up to 32MP + 32MP Up to 16MP + 16MP
  • Single Camera
    Up to 108MP Up to 16 MP(MFNR & ZSL); Up to 192 MP

RAM & Storage

Display

  • Resolution
    4096 × 2160p 3840 x 2160 pixels
  • Display Type
    4K UHD 4K Ultra HD

AnTuTu

  • Score
    686549 355200

Geekbench

  • Single core
    1047 418
  • Multi core
    3645 1720

Network

  • 5G Support
  • Modem
    Balong 5000 5G Modem Qualcomm Snapdragon X20 LTE modem

Additional Features

  • AI
    NPU AI Unit (2 big cores & 1 tiny core)
    HUAWEI Da Vinci Architecture 2.0
    Qualcomm Hexagon 685 DSP
  • Charging
    N/A Qualcomm Quick Charge 4 technology
  • Bluetooth
    Bluetooth 5.2 5.0
  • Wi-Fi
    Tri-band 2.4 GHz, 5 GHz, 6 GHz
    802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n
    Tri-band 2.4 GHz, 5 GHz, 6 GHz
    802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n
  • NFC
  • GPS
  • FM Radio





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