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  4. HiSilicon Kirin 9000 vs Qualcomm Snapdragon 865

HiSilicon Kirin 9000 vs Qualcomm Snapdragon 865

General

  • Device Type
    Mobile Platform Mobile Platform
  • Model
    Kirin 9000 SM8250
  • Announced
    October 2020 December 2019

CPU & GPU

Camera

  • Dual Camera
    Up to 32MP + 32MP Up to 32MP + 32MP
  • Single Camera
    Up to 108MP Up 48MP(MFNR, ZSL) or Up to 200MP

RAM & Storage

Display

AnTuTu

  • Score
    686549 578151

Geekbench

  • Single core
    1047 924
  • Multi core
    3645 3428

Network

  • 5G Support
  • Modem
    Balong 5000 5G Modem Qualcomm Snapdragon X55 Modem-RF System

Additional Features

  • AI
    NPU AI Unit (2 big cores & 1 tiny core)
    HUAWEI Da Vinci Architecture 2.0
    Qualcomm Hexagon 698 Processor
  • Charging
    N/A Qualcomm Quick Charge 4+ technology
    Qualcomm Quick Charge AI
  • Bluetooth
    Bluetooth 5.2 Bluetooth 5.1
  • Wi-Fi
    Tri-band 2.4 GHz, 5 GHz, 6 GHz
    802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n
    Wi-Fi-6
    Tri-band 2.4 GHz, 5 GHz, 6 GHz
    Wi-Fi 6, Wi-Fi 6-ready, 802.11ad, 802.11ay, 802.11ac Wave 2, 802.11a/b/g, 802.11n
  • NFC
  • GPS
  • FM Radio





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