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MediaTek Dimensity 1200 vs HiSilicon Kirin 9000

Dimensity 1200 vs Kirin 9000: CPU & GPU Comparison

CPU:

The MediaTek Dimensity 1200 and HiSilicon Kirin 9000, both have a tri-cluster 64-bit 8-cores CPU where the Dimensity 1200 integrates 1 ARM Cortex-A78 Big core clocked at up to 3.00GHz, 3 Cortex-A78 Medium cores at 2.60GHz, and other 4 Cortex-A55 Small cores at 2.00GHz clock speed whereas the Kirin 9000 features 1 ARM Cortex-A77 Big cores operating at up to 3.13GHz, 3 Cortex-A77 Middle cores at 2.54GHz and other 4 Cortex-A55 Little cores at 2.05GHz clock speed.

GPU:

For gaming purposes, the Dimensity 1200 integrates an ARM Mali-G77 MC9 GPU coupled with MediaTek HyperEngine 3.0 gaming technology while the Kirin 9000 integrates an ARM Mali-G78 24-cores GPU.

Manufacturing Process:

The Dimensity 1200 is fabricated on a 6nm process technology while the Kirin 9000 is designed on a 5nm process technology.

Dimensity 1200 vs Kirin 9000: Key Differences

  • The MediaTek Dimensity 1200 has a better CPU compared to the HiSilicon Kirin 9000
  • The Kirin 9000 has a better GPU and it is more power-efficient in comparison to the Dimensity 1200.
  • The Dimensity 1200 has better dual-camera support while the Kirin 9000 has better single-camera support.
  • The Kirin 9000 has better memory and display support in comparison to the Dimensity 1200.
  • The Kirin 9000 has a better AnTuTu and Geekbench score compared to the Dimensity 1200.

General

  • Device Type
    Mobile Platform Mobile Platform
  • Model
    MT6893 Kirin 9000
  • Announced
    January 2021 October 2020

CPU & GPU

Camera

  • Dual Camera
    Up to 32MP + [email protected] Up to 32MP + 32MP
  • Single Camera
    Up to 200MP Up to 108MP

RAM & Storage

Display

AnTuTu

  • Score
    622409 686549

Geekbench

  • Single core
    886 1047
  • Multi core
    2948 3645

Network

  • 5G Support
  • Modem
    Integrated 5G Modem

    Peak Download Speed: 4.7Gbps
    Peak Upload Speed: 2.5Gbps
    Balong 5000 5G Modem

Additional Features

  • AI
    Six-core MediaTek APU 3.0 NPU AI Unit (2 big cores & 1 tiny core)
    HUAWEI Da Vinci Architecture 2.0
  • Charging
    N/A N/A
  • Bluetooth
    Bluetooth 5.2 Bluetooth 5.2
  • Wi-Fi
    Wi-Fi 6 (a/b/g/n/ac/ax) Tri-band 2.4 GHz, 5 GHz, 6 GHz
    802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n
  • NFC
  • GPS
  • FM Radio





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