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  4. MediaTek Dimensity 700 vs HiSilicon Kirin 810

MediaTek Dimensity 700 vs HiSilicon Kirin 810

General

  • Device Type
    Smartphone Mobile Platform
  • Model
    MediaTek Dimensity 700 5G Kirin 810
  • Announced
    November 2020 June 2019

CPU & GPU

Camera

  • Dual Camera
    Up to 16MP + [email protected] Up to 40MP + 24MP
  • Single Camera
    Up to [email protected]
    Multi-Frame NR, 3D Noise Reduction, Depth Engine, Warping Engine, AI-FD
    Up to 48MP

RAM & Storage

  • RAM Type
    Up to 12GB LPDDR4x 8GB LPDDR4A
  • RAM Frequency
    2133MHz 2133MHz
  • Storage Type
    UFS 2.2 (2-lane) UFS 2.1, UFS 3.0

Display

  • Resolution
    2520 x 1080p 2340x1080 Pixels
  • Display Type
    Full HD [email protected] Full HD Plus

Network

  • 5G Support
  • Modem
    Integrated 5G Modem Integrated 4G Modem

Additional Features

  • AI
    MediaTek AI Processing Unit Hisilicon's first generation Da Vinci NPU
  • Charging
    N/A N/A
  • Bluetooth
    Bluetooth 5.1 5.0
  • Wi-Fi
    Wi-Fi 5 (a/b/g/n/ac) Wi-Fi 802.11 ac
  • NFC
  • GPS
  • FM Radio





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