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MediaTek Dimensity 700 vs HiSilicon Kirin 810

MediaTek Dimensity 700 vs HiSilicon Kirin 810

Product Name

MediaTek Dimensity 700
HiSilicon Kirin 810
Product Image
Price
Our Rating

9.0
9.0
Brand

MediaTek
HiSilicon Kirin
Category

Chipsets
Chipsets

General

Device Type
Smartphone Mobile Platform
Model
MediaTek Dimensity 700 5G Kirin 810
Announced
November 2020 June 2019

CPU & GPU

CPU
2 ARM [email protected]
6 ARM [email protected] 2 ARM [email protected]
6 ARM [email protected]
GPU
ARM Mali-G57 [email protected] ARM's Mali-G52 MP6
Process
7nm TSMC's 7nm
Core
Octa-Core Octa-Core

Camera

Dual Camera
Up to 16MP + [email protected] Up to 40MP + 24MP
Single Camera
Up to [email protected]
Multi-Frame NR, 3D Noise Reduction, Depth Engine, Warping Engine, AI-FD Up to 48MP

RAM & Storage

RAM Type
Up to 12GB LPDDR4x 8GB LPDDR4A
RAM Frequency
2133MHz 2133MHz
Storage Type
UFS 2.2 (2-lane) UFS 2.1, UFS 3.0

Display

Resolution
2520 x 1080p 2340x1080 Pixels
Display Type
Full HD [email protected] Full HD Plus

Network

5G Support
Modem
Integrated 5G Modem Integrated 4G Modem

Additional Features

AI
MediaTek AI Processing Unit Hisilicon's first generation Da Vinci NPU
Charging
N/A N/A
Bluetooth
Bluetooth 5.1 5.0
Wi-Fi
Wi-Fi 5 (a/b/g/n/ac) Wi-Fi 802.11 ac
NFC
GPS
FM Radio