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Qualcomm Snapdragon 870 vs MediaTek Dimensity 1000 Plus

Snapdragon 870 vs Dimensity 1000 Plus:

CPU:

GPU:

Manufacturing Process:

General

  • Device Type
    Mobile Platform Mobile Platform
  • Model
    SM8250 Dimensity 1000+
  • Announced
    January 2021 May 2020

CPU & GPU

Camera

  • ISP(Image Signal Processor)
    Qualcomm Spectra 480 image signal processor
  • Dual Camera
    Up to 25MP + 25MP Up to 32MP + 16MP
  • Single Camera
    [email protected](Up to 200MP) Up to 64MP

RAM & Storage

  • RAM Type
    4x16bit, LPDDR5 Up to 16GB LPDDR4x
  • RAM Frequency
    2750MHz Up to 2133MHz
  • Storage Type
    eMMC 5.1, UFS 2.1, UFS 3.1 UFS 2.1

Display

AnTuTu

  • Score
    679870 475522

Geekbench

  • Single core
    963 784
  • Multi core
    3394 2760

Network

  • 5G Support
  • Modem
    Qualcomm Snapdragon X55 5G Modem-RF system Integrated 5G Modem

Additional Features

  • AI
    Qualcomm Hexagon 698 Processor
    5th generation AI Engine
    15 TOPS
    MediaTek APU 3.0
  • Charging
    Qualcomm Quick Charge 4+ technology
    Qualcomm Quick Charge AI
    N/A
  • Bluetooth
    Bluetooth 5.2 Bluetooth 5.1
  • Wi-Fi
    Wi-Fi 6 (a/b/g/n/ac/ax) Wi-Fi 6 (a/b/g/n/ac/ax)
  • NFC
  • GPS
  • FM Radio





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