HiSilicon Kirin 9000 vs Snapdragon 875 Comparison

HiSilicon Kirin 9000 vs Qualcomm Snapdragon 875, Qualcomm Snapdragon 875 vs HiSilicon Kirin 9000
HiSilicon Kirin 9000 vs Qualcomm Snapdragon 875

Recently Huawei launched its new strongest 5G-ready chipsets HiSilicon Kirin 9000 and Kirin 9000E. The chipsets powers flagship devices of the Huawei Huawei Mate 40 series. The Huawei Mate 40 series comes with Kirin 9000 and 9000E chipsets. These chipsets use a tri-cluster CPU having 1 Cortex-A77 big, 3 A77 middle & 4 Cortex-A55 tiny cores. On the other side, Qualcomm is also about to launch its strongest chipset of 2020, Snapdragon 875 in December. Almost all specs of Snapdragon 875 are disclosed, based on that here we are going to compare HiSilicon Kirin 9000 vs Qualcomm Snapdragon 875 chipsets.

The Qualcomm Snapdragon 875 also supports 5G and feature the strongest CPU from Qualcomm till now. By comparing both chipsets, you’ll know which chipset is better for you and with which one you should go ahead. Let’s start the comparison and know about them.

HiSilicon Kirin 9000 vs Qualcomm Snapdragon 875

AspectsQualcomm Snapdragon 875HiSilicon Kirin 9000
CPUOcta-Core

1 ARM [email protected]

3 ARM [email protected]

4 ARM [email protected]
Octa-Core

1 ARM [email protected]

3 ARM [email protected]

4 ARM [email protected]
GPUAdreno 660ARM Mali-G78 MP24
Manufacturing Process5nm5nm
CameraDual: Up to 36MP + 36MP

Single: Up to 200MP
Dual: Up to 64MP + 48MP

Single: Up to 108MP
RAMUp to 16GB LPDDR5LPDDR5 & LPDDR4x
StorageUFS 3.1UFS 3.1
DisplayUp to 4K [email protected]
Up to 4K [email protected]
ModemQualcomm Snapdragon X60 external modemBalong 5000 5G Modem
AIQualcomm Hexagon 700 Processor
NPU AI Unit (2 big cores & 1 tiny core)

Kirin 9000 vs Snapdragon 875: CPU & GPU

CPU

Getting started with the CPU section where both chipsets feature a 64-bit octa-core tri-cluster CPU. The HiSilicon Kirin 9000 features 1 ARM Cortex-A77 Big Core clocked at up to 3.13GHz, 3 Cortex-A77 middle cores at 2.54GHz, and 4 Cortex-A55 little cores operating at up to 2.05GHz clock speed while on the other hand, the Qualcomm Snapdragon 875 will feature the Kryo 590 CPU which has 1 ARM Cortex-X1 Prime core running at 2.84GHz, 3 Cortex-A77 Gold cores at 2.42GHz and 4 Cortex-A55 Silve cores that can operate at up to 1.80GHz clock speed. The clock speed of Snapdragon 875 is the same as Snapdragon 865 but its CPU brings some upgrades over SD 865.

On-paper, both chipsets are stronger but the Snapdragon 875 has some better CPU Processing in comparison to the Kirin 9000 SoC.

GPU

Coming to the GPU section, here the Qualcomm Snapdragon 875 will have the Adreno 660 GPU whereas the HiSilicon Kirin 9000 integrates an ARM Mali-G78 24-Cores GPU.
In terms of gaming, the Kirin 9000 has a much better GPU for smooth gaming performance.

Manufacturing Process

In this section, the Kirin 9000 is built on a 5nm LPP node while the Snapdragon 875 will also use the 5nm process technology, so in terms of power-efficiency, both, the Snapdragon 875 and the Kirin 9000 will use the same power and both are much power-efficient.

HiSilicon Kirin 9000 Full Specifications, HiSilicon Kirin 9000E Full Specifications
HiSilicon Kirin 9000 Full Specifications

Kirin 9000 vs Snapdragon 875: Camera, Memory & Display

Camera

Moving on to the camera part, here the Snapdragon 875 will support a dual camera setup of up to 36MP + 36MP and a single camera of up to 200MP. It will use a Qualcomm Spectra 485 image signal processor which is a 14-bit dual ISP.

While on the other side, the Kirin 9000 features a quad-core 6th gen ISP which can support up to 64MP + 48MP dual and single-camera of up to 108MP.

Memory

Speaking of the Kirin 9000, it has support for up to 16GB [email protected] and up to 16GB LPDDR5 [email protected] & UFS 3.1 based storage while the Snapdragon 875 will support up quad-channel 16bit LPDDR5 RAM up to [email protected] and UFS 3.1 based storage.

Display

In the display section, both chipsets support up to 4k UHD displays at 60Hz.

Artificial Intelligence

For handling AI tasks, the Qualcomm Snapdragon 875 can feature a Qualcomm Hexagon 700 Processor while the Kirin 9000 has a dedicated triple-core NPU having 2 big and 1 little core. Here in terms of AI Processing, the Kirin 9000 is stronger than the Snapdragon 875, because it has better hardware than the Snapdragon 875.

Connectivity

Connectivity-wise, also both are stronger, both have support for 5G. The HiSilicon Kirin 9000 brings a Balong 5000 5G Modem while the Snapdragon 875 will adopt the Qualcomm Snapdragon X60 modem. This is a 5G modem and its full details are unknown yet. Other features in both chipsets are the same such as tri-band WiFi, Bluetooth 5.2, NFC, GPS, FM Radio, etc.

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