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HiSilicon Kirin 810

HiSilicon Kirin 810
Brand: HiSilicon Kirin
Category: Chipsets
  • CPU: ARM Cortex-A76
  • GPU: ARM Mali-G52 MP6
  • Process: TSMC's 7nm
  • Camera: 40MP + 24MP; 48MP
  • RAM: 8GB LPDDR4X
  • Display: Full HD Plus

Our Rating

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9 4.5 1
  • Rating 9 / 10

HiSilicon Kirin 810 is a 64-bit octa-core mid-range performance mobile ARM SoC introduced by HiSilicon in mid-2019. The Kirin 810 fabricated on TSMC’s 7 nm process, features 2 ARM Cortex-A76 big cores operating at up to 2.27GHz along with 6 ARM Cortex-A55 little cores operating at up to 1.88GHz. The 810 incorporates ARM’s Mali-G52 MP6 GPU.

HiSilicon Kirin 810 - Specs

General

  • Device Type
    Mobile Platform
  • Model
    Kirin 810
  • Announced
    June 2019

CPU & GPU

Camera

  • Dual Camera
    Up to 40MP + 24MP
  • Single Camera
    Up to 48MP

RAM & Storage

  • RAM Type
    8GB LPDDR4A
  • RAM Frequency
    2133MHz
  • Storage Type
    UFS 2.1, UFS 3.0

Display

  • Resolution
    2340x1080 Pixels
  • Display Type
    Full HD Plus

Network

  • 5G Support
  • Modem
    Integrated 4G Modem

Additional Features

  • AI
    Hisilicon's first generation Da Vinci NPU
  • Charging
    N/A
  • Bluetooth
    5.0
  • Wi-Fi
    Wi-Fi 802.11 ac
  • NFC
  • GPS
  • FM Radio

HiSilicon Kirin 810 - Review

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